For Laptops, Speed: PC4-21300, Module Specification: 260Pin SO-DIMM. CASLatency: CL17, Working Voltage: 1.2V
High speed up to 2666MHz, Transfer bandwidth up to 21.3GB/s.8-layer PCB provides improved signal transfer and system stability
Energy efficient: save up to 20% compared to DDR3. OperatingTemperature: 0°C-85°C
Supports Intel Skylake and Coffee Lake platforms,future-proof for Kaby Lake & Cannon Lake platforms. Complies with JEDECstandards and RoHS compliant
ADATA standard SO-DIMM, Very Low-Profile modules (VLP), orsmall outline modules (SO-DIMM) for notebooks, all implement cutting edge technology that enables remarkable memory quality, stability, and reliability.
Standard: JEDEC ; Interface: 260-pin ; DRAM activation power supply: VPP = 2.5V ( +0.25V / -0.125V )